By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the newest details on a mainstream method that's serious for high-volume, high-yield semiconductor production, or even extra in order equipment dimensions proceed to reduce. The expertise has grown to surround the elimination and planarization of a number of steel and dielectric fabrics and layers either on the equipment and the metallization degrees, utilizing diverse instruments and parameters, requiring advancements within the keep an eye on of topography and defects.
This vital booklet deals a scientific assessment of basics and advances within the sector. half One covers CMP of dielectric and steel motion pictures, with chapters concentrating on using specific options and techniques, and on CMP of specific a variety of fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP techniques.
Part addresses consumables and method regulate for more suitable CMP, and comprises chapters at the training and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor tactics, and ways for defection characterization, mitigation, and reduction.
- Considers suggestions and procedures for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and approach regulate for more desirable CMP
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Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) by Suryadevara Babu